What is CoWoS Packaging?

Instead of single chips, advanced computing systems often rely on multiple chips working in conjunction with each other. Also called chip-on-wafer (CoW) packages, this refers to a stack of chips on a silicon wafer, also called a silicon interposer or carrier.

News

Thermal Management for CoWoS: Advanced Modules for AI & HPC Systems

Posted on April 25, 2025 (August 25, 2025) by T-Global USA

Efficient heat dissipation in CoWoS systems is vital for advanced packaging in AI, HPC, and data centers—enabled by vapor chambers, liquid-metal TIMs, and microfluidic cooling.