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Ultimate Guide to Thermal Management
The Ultimate Guide to Thermal Management Solutions

This essential guide enables you to find the best thermal solutions you need—from gap fillers to graphene and vapor chambers. As form factors shrink and power densities increase, here are what optimize heat dissipation in compact, high-power electronics.

racing car sponsor
Gaucho Racing Gets a Boost from T-Global in Formula SAE Electric!

T-Global proudly sponsors UCSB’s Gaucho Racing in the Formula SAE Electric Challenge—providing thermal materials that boosted performance and reliability, and helped the student team achieve a record 20 % improvement!

A 3D thermal simulation image showing the heat distribution of a heatsink with a cooling fan on top. The color gradient ranges from blue (cooler areas) to red (hotter areas), representing solid temperatures in degrees Celsius from 25.174°C to 31.193°C. Two temperature callouts highlight specific areas: one at 28.214°C and another at 31.186°C. An inset shows a person analyzing thermal simulation data on a printed chart. The visualization emphasizes thermal management and analysis in electronic components.
Stay Cool: The Rise of Electronic Cooling in Modern Tech

Explore how advanced cooling—from passive heat sinks and vapor chambers to active fans, liquid loops, and TECs—ensures electronics stay reliable, efficient, and long-lasting. Learn which methods matter most for your design.

Graphite, Graphene, and Synthetic Graphite
Future Materials for Advanced Technologies: Graphite, Graphene, and Synthetic Graphite

Graphite, graphene, and synthetic graphite are highly conductive, durable carbon materials. This next-gen energy solution is transforming the stability of electronics, batteries, and communications.

advanced packaging technology
Thermal Management for CoWoS: Advanced Modules for AI & HPC Systems

Efficient heat dissipation in CoWoS systems is vital for advanced packaging in AI, HPC, and data centers—enabled by vapor chambers, liquid-metal TIMs, and microfluidic cooling.

Vapor Chambers Performance Calibration Using Photonics Technologies
Vapor Chamber Performance Calibration Using Photonics Technologies

Title: Calibration of the Performance Measurement for Thin Vapor Chambers by Photonics Technologies Author: Kuang-Yu Hsu, Yi-Jing Chu, Andhi Indira Kusuma, Krishn Patel, Rajveer G. V., and Ming-Hsien Hsiao Abstract:…

Understanding Thermal Interface Materials: Types and Applications
Understanding Thermal Interface Materials: Types and Applications

Thermal interface materials (TIMs) bridge gaps between components and heatsinks—enhancing heat transfer in ever-smaller electronics. From pads & greases to phase-change films and graphite, learn which TIM fits your needs.

heat dissipation and thermal transfer
Heat Dissipation and Thermal Transfer

Effective heat dissipation via conduction, convection, and radiation ensures the safety, performance, and longevity across electronics, EVs, and energy systems. Discover how the advanced thermal solutions deliver reliability and efficiency.

thermal management in energy
Thermal Management in Energy

T-Global pioneers passive and active thermal solutions. Discover how advanced TIMs, heat sinks, pads, and TECs enhance energy efficiency, reliability, and longevity in EVs and power systems.