Find answers to common questions about product properties, testing, customization, and support. Get expert guidance on thermal solutions. Contact us at usa@tglobal-usa.com.
Find answers to common questions about product properties, testing, customization, and support. Get expert guidance on thermal solutions. Contact us at usa@tglobal-usa.com.
A minimum of 10 psi is recommended.
Our thermal pad maintains its initial contact pressure under normal conditions. However, prolonged use or extreme conditions may affect its long-term performance.
Our putty series does not cure. It stays in a paste consistency.
The standard shelf life is one year.
The tolerance varies depending on the thickness of the pad.
Composition, filler type, thickness, surface contact, and pressure affect TIM thermal conductivity.
Thermal conductivity defines heat transfer ability, while thermal resistance measures heat flow resistance. Resistance increases with material thickness, but conductivity is independent of thickness.
Thermal resistance measures a material’s opposition to heat flow, while thermal impedance includes interface resistance. Lower values improve heat dissipation, reducing overheating risks in electronic devices.
Rough surfaces create air gaps that reduce efficiency; smoother surfaces improve heat transfer.
Higher pressure improves contact and heat transfer but may cause mechanical stress.
Includes ASTM D5470, TIM Joint Resistance Measurement, Thermal Cycling, and Dielectric Strength Testing.
Yes, T-Global USA offers pre-cut and die-cut profiles for thermal pads.
Yes, T-Global USA offers customized solutions, including post-processing, custom modules, and thermal simulation/testing.
Durability: While thermal grease may dry out and degrade over time, thermal putty is more stable, lasting longer without the need for reapplication.
Gap Size: Thermal putty is better suited for situations where there is a larger gap between components, while thermal grease is ideal for tightly fitted surfaces.
Viscosity: The viscosity of thermal putty is higher than thermal grease, so thermal putty is able to stay in position without flowing.
Selection depends on thermal conductivity needs, temperature range, mechanical compliance, and assembly process. You can either contact us for technical support or view our ultimate guide to find the optimal solutions.
Vapor chambers provide uniform heat spreading with lower thermal resistance than heat pipes, making them ideal for compact, high-power applications with custom shape flexibility.
Graphene and graphite-based TIMs offer higher thermal conductivity, lightweight design, durability, and superior in-plane heat spreading, making them efficient for high-performance electronic cooling.
T-Global manufactures thermal interface materials such as pads, grease, putty, and potting compounds. Graphite, graphene, ceramic spreaders, and phase change materials (PCM) are outsourced.
For thermal modules, we handle design and assembly. Manufacturing vapor chambers ourselves while having heat sinks, heat pipes, and fans outsourced.
Our product are MIT. They are manufactured in Taiwan!
Standard TIM products: 20 working days.
Customized thermal modules: 30 working days after receiving an official order.
Yes! We offer comprehensive support, including product selection, post-processing, thermal simulations, multiple measurement techniques, and integration guidance to ensure optimal performance. Contact us today to discuss your project needs!
Yes, samples are available for evaluation.