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Consumer Electronics

Consumer electronics include an array of devices designed for communication, information purposes, or entertainment. Two common hazards that can interfere with good electronic performance are electromagnetic interference (EMI) and excess heat. At T-Global, we develop state-of-the-art systems to address these hazards and promote reliable performance in consumer electronics. Benefits of our solutions include:

  • High-performance thermal interface materials (TIMs) that dissipate heat and create a protective barrier
  • EMI shielding materials that resolve escalating temperature and EMI issues
  • Miniaturization of components through multi-functional layer construction
  • Zero air gap construction for portable devices

Our thermal and EMI shielding materials make electronics more robust and resistant to damage from temperature extremes, electrical signal interference, and inefficiencies in earlier-generation designs. Learn more about our capabilities and how our solutions meet the thermal management needs of an evolving marketplace.

Enhance Your Consumer Electronics with Advanced Thermal & EMI Solutions

T-Global’s TIMs are designed to mitigate overheating issues commonly seen in consumer electronics. When electronics are used for long periods of time or at peak capacities, they generate a lot of heat. This heat can transfer to fragile components or build up in the heated sub-assemblies, leading to breakage, malfunctions, and reduced performance. By placing our TIMs between chips or components and a dissipating device, manufacturers can control the path of heat throughout the electronic device and keep it from damaging vulnerable components.

As technology continues to advance, components in consumer electronics have become increasingly small, efficient, and powerful. Microelectronics contain microscopic chips, components, and sub-assemblies—and, with effective TIMs from T-Global, manufacturers can incorporate more sub-assemblies into a compact design. These are more than just thermal compounds for attaching a heat sink to a CPU. They can incorporate a number of advanced materials to improve heat transfer and enhance the performance of components.

Thermal Interface Material Options

T-Global’sTIMs create highly conductive paths between heat-generating components and heat-sinking elements. Consider the following TIM options:

Thermal Grease (Pastes)

T-Global’s thermal grease fills gaps between heat-generating components and a specific surface. They can act as a binding agent to hold machined or extruded heat sinks against the heat-generating component, allowing for more efficient heat dissipation. Our thermal grease can be applied manually or via automation systems.

Thermal Putties

T-Global offers a range of thermal putties for cooling electronic devices. These putties are designed with dispensing systems that optimize product flow. Thermal putties from T-Global are also fully cured and re-workable, with silicone and non-silicone options to suit varying application requirements.

Potting Compounds

T-Global’s potting compounds serve multiple functions. Our compounds can facilitate efficient heat transfer away from components. In addition, they maintain excellent electrical insulation and can enhance the performance and lifespan of delicate components.

Phase-Change Materials(PCM)

Our thermal greases perform a similar function to thermal pastes, except manufacturers can screen-print thermal grease layouts to create paths that connect heat-generation components with heat sinks.

For a high-performance alternative, consider phase-changing thermal greases. These PCMs use latent heat to maintain a specified temperature range, solidifying as they release heat and liquefying as they absorb heat.

Thermal Pads

Thermal pads from T-Global are a dependable TIM option that works best with manual installation. T-Global can pre-cut bulk thermal pads into specific sizes or profiles before attaching them to a heat-generating component and layering them into an electronic assembly. Common applications for our thermal pads include:

  • Attaching in between heat sink and semiconductor components such as power discrete devices and integrated circuits (IC)
  • Attaching battery modules to chassis
  • Attaching PCB enclosures

T-Global's Consumer Electronics Capabilities

At T-Global, we specialize in developing high-quality TIMs for various consumer electronics companies. We leverage our capabilities to provide clients with the following product options for smartphones, smart home systems, personal computers, and other electronic devices:

We also provide specialized products for unique applications, such as thermal insulators for semiconductors, compression jointing materials for temperature sensors and thermistors, and conductive TIMs for all types of heaters. Our team of development scientists and engineers is committed to building high-quality solutions that last, with current ISO 9001 and ISO 14001 certifications. We also adhere to ASTM, IECQ, RoHS, REACH, and UL standards.

Learn More With T-Global

Thermal interface materials are a continually developing solution for electronic systems with fragile components. As electronics become more compact and more powerful, they will continue to generate more heat and need even more effective ways to remove it. That’s why T-Global continues to innovate high-quality TIM solutions that promise efficiency, effectiveness, and manufacturability.

We make it easy for companies to find the products they need, with customization options, easy payment, fast delivery, and a customer support team that is available 24/7 to answer questions and help finalize your order. Contact us today to get started.

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