Post Process

Experience precision with die-cutting, where shapes are cut through the entire Thermal Interface Materials (TIMs).

Ideal for creating intricate designs in next-gen thermal management solutions, this technique ensures clean edges and a professional finish for diverse applications.

Kiss cutting cuts only the thermal pad, leaving the liners on both sides intact.

This clean processing method is optimized for automated assembly lines and is especially efficient for small TIM pieces — accelerating liner removal in high-throughput environments such as consumer electronics or IoT device manufacturing.

Film cutting cuts through the upper liner and the thermal pad together, streamlining the application process.

Commonly used for thermal tapes, this technique supports automated pick-and-place systems and volume manufacturing — enhancing workflow in thermal module integration for LEDs, and mobile devices.

Enhance durability with our fiberglass mesh thermal pads. This robust reinforcement provides exceptional strength and stability, making it ideal for high-temperature and high-power applications where reliability is crucial for optimal performance.

Our low cohesive thermal pads offer one-sided low tack or double-sided non-tacky options, optimizing heat transfer.
Designed to reduce thermal resistance, they enhance cooling efficiency.

Our PET-laminated thermal pads deliver excellent moisture resistance and durability. Ideal for standard applications, they provide reliable thermal management while maintaining flexibility, ensuring optimal performance in various environments.

Experience superior thermal stability with our Polyimide-laminated thermal pads. Designed for high-temperature applications, they withstand extreme conditions while offering exceptional insulation, making them perfect for demanding environments requiring enhanced reliability.