Custom Thermal Module Solutions by T-Global
At T-Global, we provide tailored thermal module solutions to meet the unique cooling demands of various industries.
At T-Global, we provide tailored thermal module solutions to meet the unique cooling demands of various industries.
At T-Global, we offer standard thermal modules and full customization to meet your cooling needs. Beyond off-the-shelf solutions, we provide expert services in simulation, design, sampling, and manufacturing. Whether standard or custom, we ensure precision, efficiency, and innovation in every project.
Provide your inquiry details through ‘Quote & Sample,’ our consultants will reach out to you ASAP.
The mechanical design, heat source size/wattage, quantity requirements, and other details will be discussed thoroughly.
Our consultants will offer you a total and tailored thermal solutions.
Tracking the project’s progress to ensure it stays on schedule and meet your expectation.
A vapor chamber is a high-performance thermal solution that efficiently spreads heat using phase change technology. It offers ultra-low thermal resistance in XY and Z directions, outperforming metal and ceramic alternatives. Lightweight and thin, it’s ideal for processors, GPUs, and servers, ensuring superior heat dissipation for high-density applications.
A vapor chamber works like a heat pipe but offers 2D thermal conduction for superior heat dissipation. Inside, a capillary-structured vacuum chamber enables rapid fluid vaporization and condensation, efficiently transferring heat. This continuous cycle ensures effective cooling, making it ideal for high-performance thermal management in advanced electronic devices.
Q-Max | Thickness (mm) | ||
---|---|---|---|
Size (mm) | 2 | 3 | 4 |
60x80 | 50 | 70 | 90 |
90x90 | 80 | 120 | 160 |
100x100 | 140 | 200 | 260 |
120x80 | 130 | 200 | 250 |
180x150 | 160 | 250 | 300 |
200x120 | 200 | 300 | 400 |
350x100 | 220 | 350 | 450 |
A heat sink, typically made of aluminum or copper, serves as both a cooling component and mechanical housing. Manufactured through stamping, extrusion, die casting, or forging, it efficiently dissipates heat. Surface treatments enhance performance, while customized designs optimize thermal conductivity and surface area for improved heat dissipation efficiency.
A heat sink works by absorbing heat from a source and dissipating it into the surrounding air through conduction, convection, and radiation. Made of high thermal conductivity materials like aluminum or copper, its increased surface area enhances heat transfer, improving cooling efficiency for electronic and industrial applications.
A heat pipe is a highly efficient passive cooling device that uses phase change and convection principles to transfer heat. It consists of a sealed tube with a wick structure and working fluid, rapidly dissipating single-point heat by cycling liquid-to-vapor transformation for superior thermal management.
A heat pipe removes internal air, seals in a working fluid, and uses low-pressure vaporization for efficient heat transfer. Heat absorption causes rapid evaporation, moving vapor to the condensation zone, where it releases heat and returns to liquid. This continuous cycle enables heat transfer 50–100 times more effective than aluminum.
Diameter(mm) | Thickness(mm) | Width(mm) |
---|---|---|
Ø4 | 2 | 5.65 |
2.5 | 5.55 | |
3 | 5.45 | |
Ø5 | 2 | 6.91 |
2.5 | 6.59 | |
3 | 6.32 | |
3.5 | 6.01 | |
4 | 5.68 | |
Ø6 | 2 | 8.5 |
2.5 | 8.18 | |
3 | 7.95 | |
3.5 | 7.65 | |
4 | 7.39 | |
Ø8 | 2 | 11.65 |
2.5 | 11.39 | |
3 | 11.15 | |
3.5 | 10.83 | |
4 | 10.6 | |
4.5 | 10.27 | |
5 | 10.01 | |
6 | 9.36 |
Fans are essential cooling components used in industrial and electronic products for thermal management. By generating airflow, they dissipate heat, ensuring optimal performance and efficiency. Common in electrical machinery and electronic devices, fans prevent overheating, enhancing system reliability and longevity.
A cooling fan operates by creating airflow to dissipate heat from industrial and electronic equipment. As air moves across heated surfaces, it carries away excess heat, maintaining stable temperatures and preventing performance degradation due to overheating.
A cold plate is a high-efficiency liquid cooling solution that absorbs and dissipates heat from electronic components. It enhances thermal management by circulating coolant through precision-engineered channels for superior heat transfer.
Cold plates operate by circulating liquid coolant through internal channels, absorbing heat from the source and transferring it to a remote heat exchanger. This ensures efficient, uniform cooling for high-power electronic applications.
Thermoelectric cooling chips (TEC) are advanced cooling devices that utilize the Peltier effect for precise temperature management. By applying electrical current, they efficiently absorb heat on one side and release it on the other, making them ideal for sensitive electronics and medical applications.
TEC modules operate on the Peltier effect, using P-type and N-type semiconductors. When a direct current flows through the thermocouple, one side cools while the other heats up, enabling effective temperature regulation. This principle allows TECs to maintain stable conditions in various industrial and scientific settings.