Thermal Putty
Our gap-filling thermal putties provide superior thermal conductivity and flexibility, available in silicone and non-silicone options.
With lower thermal resistance than pads, they effectively fill gaps between components and heat sinks, ensuring efficient cooling in electronics, automotive, and industrial applications across the USA.
With lower thermal resistance than pads, they effectively fill gaps between components and heat sinks, ensuring efficient cooling in electronics, automotive, and industrial applications across the USA.
Thermal Putty
Thermal Conductivity (TC)
Thermal Impedance (TI)
Viscosity (V)
Density (D)
Volume Resistivity (VR)
Silicone Type
| Properties | Thermal Conductivity | Thermal Impedance | Viscosity | Density | Volume Resistivity | ||
|---|---|---|---|---|---|---|---|
| Unit | W/m•K | cal/cm·sec·°C | RA(K-in.^2/W) | Pa.s | g/cm³ | Ohm-m | |
 TG4040 Thermal Putty | 3.2 | 0.007648 | 0.580 | 250 | 2.9 | 1x1013 | Quote & SampleDatasheet |
 TG6060 Thermal Putty | 6.3 | 0.015057 | 0.332 | 270 | 3.3 | 1x1013 | Quote & SampleDatasheet |
TG-A7000 Thermal Putty | 7 | 0.01673 | 0.287 | 250 | 3.25 | 1x1013 | Quote & SampleDatasheet |
| Test Method | ASTM D5470 Modified | Brookfield | ASTM D792 | ASTM D257 | |||
Non-silicone Type
| Properties | Thermal Conductivity | Thermal Impedance | Viscosity | Density | Volume Resistivity | ||
|---|---|---|---|---|---|---|---|
| Unit | W/m•K | cal/cm·sec·°C | RA(K-in.^2/W) | Pa.s | g/cm³ | Ohm-m | |
 TG-N4000 Non-silicone Thermal Putty | 4 | 0.00956 | 0.474 | 350 | 2.6 | 1x1010 | Quote & SampleDatasheet |
 TG-NSP25 Non-silicone Thermal Putty | 2.6 | 0.006214 | 0.327 | 5000 | 2.6 | 1x1014 | Quote & SampleDatasheet |
 TG-N8000 Non-silicone Thermal Putty | 8 | 0.01912 | 0.689 | 430 | 3 | 1x1010 | Quote & SampleDatasheet |
| Test Method | ASTM D5470 Modified | Brookfield | ASTM D792 | ASTM D257 | |||