Potting Compound
Our silicone and epoxy potting compound provide excellent thermal conductivity, high-temperature resistance, and superior protection against environmental damage.
With curing times from 2 to 18 hours at room temperature and viscosities from low to very high, they ensure reliable performance in various industries.
Potting Compound
Thermal Conductivity (TC)
Curing Time @25ﾟC (CT)
Hardness (H)
Viscosity (V)
Dielectric Breakdown Voltage (BV)
Gel Type
| Properties | Thermal Conductivity | Curing Time @25ﾟC | Hardness | Viscosity | Dielectric Breakdown Voltage | ||
|---|---|---|---|---|---|---|---|
| Unit | W/m•K | cal/cm·sec·°C | Hrs | Shore OO/A | Pa.s | KV/mm | |
 TG-ASD35AB Curable Thermal Gel | 3.5 | 0.008365 | 2-4 | OO 40 | @1.0rpm: A: 250 B: 250 | 7 | Quote & SampleDatasheet |
 TG-ASD50AB Curable Thermal Gel | 5.0 | 0.011950 | 2-4 | OO 40 | @1.0rpm: A: 250 B: 250 | 5 | Quote & SampleDatasheet |
| Test Method | ISO 22007-2 | ASTM D2240 | Brookfield | ASTM D149 | |||
Silicone Type
| Properties | Thermal Conductivity | Curing Time @25ﾟC | Hardness | Viscosity | Dielectric Breakdown Voltage | ||
|---|---|---|---|---|---|---|---|
| Unit | W/m•K | cal/cm·sec·°C | Hrs | Shore OO/A | Pa.s | KV/mm | |
 TG-A09AB Potting Compound | 2.8 | 0.006692 | 6 | OO 90 | 10~50 | 11 | Quote & SampleDatasheet |
| Test Method | ASTM D5470 Modified | ASTM D2240 | Brookfield | ASTM D149 | |||