Understanding Thermal Interface Materials: Types and Applications

As electronic devices get smaller and more powerful, excess heat becomes a serious challenge, requiring efficient solutions to prevent performance issues and hardware failures. Thermal interface materials (TIMs) offer a cost-effective way to manage heat in various electronic components and devices. The right thermal interface material can help maintain stable operating temperatures and even optimize performance in electronics. This blog article will highlight the different types of thermal interface materials and their applications, so you can find the right product for your thermal management needs.

What Are Thermal Interface Materials and Why Are They Important?

TIMs dissipate heat in electrical components like semiconductors and transfer it to a heat sink. Semiconductor assemblies and circuitry require TIMs to keep electronics performing optimally, as too much heat exposure can physically damage the components, causing irreparable flaws, malfunctions, and potentially even component failure.

How exactly do TIMs work in thermal management applications? Manufacturers build chips with semiconductors and heat sinks next to each other for more efficient heat energy conduction. Any gaps will allow air in between the semiconductor and heat sink, resulting in excess thermal resistance.

TIMs fill the gaps between the mating surfaces of the heat-generating component and the substrate. They don’t require the moving components, extra space, or energy consumption of traditional thermal management solutions. In turn, they measurably improve heat transfer between the surfaces while enhancing the efficiency of the thermal management system.

Exploring the Types of Thermal Interface Materials

There are many different types of thermal interface materials, from thermal pads and adhesive tapes to phase-changing materials. Popular TIMs for passive thermal management include:

Thermal Pads and Tape

Thermal pads are solid, thin sheets of thermal conductive material. Manufacturers can place thermally conductive pads between individual central processing units (CPU) to remove air gaps and conduct heat away toward a heat sink.

Similarly, thermal tapes act as a bridge to move heat away from a heat source. Their adhesive surfaces also add structural stability to the assembly by keeping components locked in place. Common uses for adhesive tapes include attaching LED lights or semiconductor assemblies to heat sink surfaces.

Thermal Pastes, Putties, Gels, and Greases

These thermal interface materials have different consistencies to meet unique application requirements. For instance, thermal putty and grease have higher viscosity and are more conformable when filling gaps and uneven surfaces between the heat source and heat sink. Other types, like thermal pastes and gel, have a lower viscosity, making them suitable for use with electronic components and equipment.

Phase-Changing Materials (PCMs)

Phase-changing TIMs are designed to change states as they absorb and release heat. These materials remain solid at room temperatures but become fluid at temperatures of 131 °F to 149 °F (55 °C to 65 °C). These phase-changing capabilities make the materials easy to install and handle while still providing optimal conductivity and performance.

Potting Compounds and Liquid Adhesives

Potting compounds are thermally conductive sealants. These compounds both conduct heat away and act as a protective shield underneath its surface. They can even increase product longevity in electrical systems, making them an ideal choice for a number of applications.

Adhesives also serve multiple purposes in electronic assemblies, moving heat away from vulnerable components and holding components tightly together. They come in different forms, such as fluid curing products, adhesive tapes, and adhesive sheets.

Advanced Materials

One innovative solution that is becoming increasingly popular for semiconductor assemblies is graphite sheets. These solutions exhibit the following qualities:

Physically flexible, fitting seamlessly into tight or compact configurations
High-quality, reliable conduction capabilities in niche applications
Unique anisotropic properties, meaning their properties can vary depending on the direction of measurement

Applications of Thermal Interface Materials

Thermal interface materials are a significant part of any efficient thermal management system. Some of the most common applications for TIMs are printed circuit boards (PCBs) for consumer electronic goods and commercial and industrial electronic assemblies. Modern-day IC PCB options are more versatile and powerful than their rigid predecessors, with uses in products such as:

Aerospace assemblies
Industrial control systems
Laptops
Medical devices and medical equipment
Smartphones and tablets
Telecommunication networks

These PCBS can incorporate thermal interface materials to promote efficient, reliable performance.

Why Choose T-Global for Thermal Interface Materials?

A T-Global Technology, we offer a wide range of compact and high-performance passive thermal management materials built to control, transfer, and dissipate heat in circuits and electrical assemblies. Our solutions include adhesive tapes, pastes, gels, phase-changing materials, thermal pads, and advanced custom solutions.

We’re continually innovating our selection of thermal interface materials to meet the project goals, timelines, and budgets of our clients, including the development of advanced material options for better heat dissipation and management. Our organization is ISO 9001, ISO 14001, and IECQ QC080000 certified, and our commitment to quality shows in every order we complete.