Curable Thermal Gel with a silicone base provides excellent thermal conductivity, rebound resilience, and vibration absorption.
Designed for harsh automotive and electronic environments, it cures in place to ensure long-term stability, efficient heat transfer, and reliable protection of components, making it ideal for demanding automotive-grade thermal management and other electronic systems.
| Properties | Thermal Conductivity | Curing Time @25゚C | Hardness | Viscosity | Dielectric Breakdown Voltage | ||
|---|---|---|---|---|---|---|---|
| Unit | W/m•K | cal/cm·sec·°C | Hrs | Shore OO | Pa.s | KV/mm | |
![]() TG-ASD35AB Curable Thermal Gel | 3.5 | 0.008365 | 2-4 | 40 | @1.0rpm: A: 250 B: 250 | 7 | Quote & Sample |
![]() TG-ASD50AB Curable Thermal Gel | 5.0 | 0.011950 | 2-4 | 40 | @1.0rpm: A: 250 B: 250 | 5 | Quote & Sample |
| Test Method | ISO 22007-2 | ASTM D2240 | Brookfield | ASTM D149 | |||