Our silicone potting compound offers outstanding thermal conductivity, high-temperature resistance, and robust environmental protection. Designed for electronic components protection and encapsulation, it provides insulation and mechanical support.
Featuring a 6-hour curing time at room temperature and a viscosity range of 10–50 Pa·s, it ensures reliable performance across diverse industries. For even faster results, the curing time shortens significantly at elevated temperatures, making it ideal for time-sensitive production environments.| Properties | Thermal Conductivity | Curing Time @25゚C | Hardness | Viscosity | Dielectric Breakdown Voltage | ||
|---|---|---|---|---|---|---|---|
| Unit | W/m•K | cal/cm·sec·°C | Hrs | Shore OO | Pa.s | KV/mm | |
TG-A09AB Potting Compound | 2.8 | 0.006692 | 6 | 90 | 10~50 | 11 | Quote & Sample |
| Test Method | ASTM D5470 Modified | ASTM D2240 | Brookfield | ASTM D149 | |||
| Properties | Thermal Conductivity | Curing Time @25゚C | Hardness | Viscosity | Dielectric Breakdown Voltage | ||
|---|---|---|---|---|---|---|---|
| Unit | W/m•K | cal/cm·sec·°C | Hrs | Shore A | Pa.s | KV/mm | |
TG-A96AB Potting Compound | 2.6 | 0.006214 | 12 | 68 | 1.8~2.5 | 11 | Quote & Sample |
| Test Method | ASTM D5470 Modified | ASTM D2240 | Brookfield | ASTM D149 | |||