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Potting Compound

Potting Compound

Our silicone potting compound offers outstanding thermal conductivity, high-temperature resistance, and robust environmental protection. Designed for electronic components protection and encapsulation, it provides insulation and mechanical support.

Featuring a 6-hour curing time at room temperature and a viscosity range of 10–50 Pa·s, it ensures reliable performance across diverse industries. For even faster results, the curing time shortens significantly at elevated temperatures, making it ideal for time-sensitive production environments.

Potting Compound

Potting Compound
Thermal Conductivity (TC)
Curing Time @25゚C (CT)
Hardness (H)
Viscosity (V)
Dielectric Breakdown Voltage (BV)

Silicone Type

PropertiesThermal ConductivityCuring Time @25゚CHardnessViscosityDielectric Breakdown Voltage
UnitW/m•Kcal/cm·sec·°CHrsShore OOPa.sKV/mm
TG-A09AB Potting Compound
TG-A09AB Potting Compound
2.80.00669269010~5011Quote & Sample
Test MethodASTM D5470 ModifiedASTM D2240BrookfieldASTM D149

Epoxy Type

PropertiesThermal ConductivityCuring Time @25゚CHardnessViscosityDielectric Breakdown Voltage
UnitW/m•Kcal/cm·sec·°CHrsShore APa.sKV/mm
TG-A96AB Potting Compound
TG-A96AB Potting Compound
2.60.00621412681.8~2.511Quote & Sample
Test MethodASTM D5470 ModifiedASTM D2240BrookfieldASTM D149